Speaker
Description
Fermilab is organizing a 3D Heterogeneous Integration Multi-Project Wafer (3DHI-MPW) run to meet the current advanced packaging needs of scientific instrumentation as well as to further the state-of-the-art in advanced packaging for small-volume users.
Our goals are to:
1. Leverage high density face-to-face/face-to-back wafer bonding for current and future projects
2. Start the first of many community-organized, regularly-scheduled 3DHI-MPW runs in order to:
1. Develop the 3DHI low-volume prototyping community, and
2. Create a 3DHI-MPW fabrication methodology analogous to the 2D VLSI MPW fabrication methodology currently enjoyed by the HEP community.
3. Advance and standardize industry-wide TSVs, (including)
1. Define and develop open standards to facilitate 3D integration of diverse heterogenous wafers from multiple foundries
