4D Tracking

Name: 4D Tracking
Start: 2020-09-23T12:00:00-07:00
End: 2020-09-23T14:00:00-07:00
Location: No location set

Wednesday 23 Sept 2020, 12:00 → 14:00 America/Los_Angeles

Description

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Password: 314159

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Sensors (Chris)

3D: Challenge is manufacturability: how to engineer gain. Otherwise, w/o gain these sensors are too noisy
(AC-coupled) LGAD: Practical to build. Fast and good resolution. Challenge is radiation hardness. Depending on the radial layer, this might be the best option for LS4.
MAPS: Requires to convince a Foundry to incorporate gain into their process. Extremely unlikely (and rsiky).

Electronics (Angelo)

Going to 25x25um means x4 increase in electronics and power. It will be very difficult to fit a TDC architecture in such small area. The solution might be to go the deeper 28nm technology.
- Note that better resolution --> more electronics --> larger area for circuits
- Other considerations are dynamic range, and conversion time (dead time)
- 28nm likely to be more rad-hard and use less power.
In summary, 28nm technology seems to be an extremely promising venue for 4D tracking elecgronics: very fast, less power, can fit more electronics --> better resolution, more rad-hard, and because one can fit more electronics, likely better dynamic range.

Next steps:

Need to develop a full concept: AC-LGAD // Front End + TDC (28nm) // Readout
Lots of R&D require --> need to find collaborators and build prototypes
Consider two different use cases with very different approaches:
- LS4: likely only 1 layer (2nd or 3rd due to radiation considerations)
- future collider

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